This unique design of a small profile array card edge connector enables Mechanical Design Engineers to reduce the PCB real estate that was previously required for side to side stackability of CE connectors. The 3.25mm centerline to centerline spacing between connectors and .5mm pitch of the connector allows Designers greater flexibility in their board layout.
981221K112-2QMK
Plating: 30µ Au over 50µ Min Ni
Size: 112 position
Solder Tail Length: .25
Features & Benefits
- Minimum side to side stackability
- High density .5mm Card Edge
- SMT configuration
- RoHS Compliant product available
- This connector is currently available in 112 position with keying feature – other sizes are available for development by customer request
- Mates with a 1.06mm-1.23mm thick daughter card
- Small profile, minimum overall height 6mm and 2.75mm wide
- Insert molded using liquid crystal polymer for stability in hybrid board applications involving surface mount components requiring convection or IR heating
Specifications
Electrical
- Contact resistance: 20 milliohm (maximum)
- Dielectric withstanding voltage: 300 VAC (RMS)
- Current rating: 1.0amp (continuous)
- Insulation resistance: <100 Megaohms at 300VDC
- Resin Material: LCP UL rated 94 V-O
- Operating Temperature: -40ºC to 105ºC
Mechanical
- Contact material: Copper Alloy
- Contact finish: Gold over nickel on both interface and solder tail regions
- Insertion force: 1.63 kg
- Withdrawal force: 0.84 kg
- Normal force: 63 grams nominal