The PSOP, SSOP and TSOP sockets are designed for use in OEM, prototyping and programming applications. The unique positive locking lid secures devices to high normal force surface mount contacts. The common land-pad footprint of the socket and device eliminates the need to modify a PCB layout after development stages. These zero insertion force sockets can be effortlessly loaded and unloaded.
980020-40-P1-K
40 Pos. TSOP Socket
Positioning Posts: NO
Height: 5.33mm (.210”)
Pitch: .5mm (.020”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980020-40-P2-K
40 Pos. TSOP Socket
Positioning Posts: YES
Height: 5.33mm (.210”)
Pitch: .5mm (.020”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980020-48-P1-K
48 Pos. TSOP Socket
Positioning Posts: NO
Height: 5.33mm (.210”)
Pitch: .5mm (.020”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980020-48-P2-K
48 Pos. TSOP Socket
Positioning Posts: YES
Height: 5.33mm (.210”)
Pitch: .5mm (.020”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980020-56-P1-K
56 Pos. TSOP Socket
Positioning Posts: YES
Height: 5.33mm (.210”)
Pitch: .5mm (.020”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980020-56-P2-K
56 Pos. TSOP Socket
Positioning Posts: YES
Height: 5.33mm (.210”)
Pitch: .5mm (.020”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980021-44-P1-K
44 Pos. PSOP Socket
Positioning Posts: NO
Height: 7.33mm (.289”)
Pitch: 1.27mm (.050”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980021-44-P2-K
44 Pos. PSOP Socket
Positioning Posts: YES
Height: 7.33mm (.289”)
Pitch: 1.27mm (.050”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980022-56-P1-K
56 Pos. SSOP Socket
Positioning Posts: NO
Height: 6.28mm (.247”)
Pitch: .80mm (.0315”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
980022-56-P2-K
56 Pos. SSOP Socket
Positioning Posts: YES
Height: 6.28mm (.247”)
Pitch: .80mm (.0315”)
BdMt Style: Surface Mount (SMT)
Plating: 10µin Pd over 50µin Min Ni
Solder Tail Length: NA
Features & Benefits
- For OEM, prototyping, programming & test applications
- Surface mount
- Zero insertion force
- Land pad footprint common for package & socket
- Positive locking lid design
- Effortless loading & unloading
- High normal force contacts
- Available without alignment pins for pick and place
- Available with alignment pins to facilitate hand placement
- Standard packaging is available in tape & reel configurations
- RoHS Compliant
Specifications
- Contact Resistance: 30 milliohm (max)
- Dielectric Withstanding Voltage: 250 VAC
- Current Rating: 0.5 AMP
- Insulation Resistance: 500 Megaohms
- Flammability 94 V-O
- Operating Temperature: -55°C to +105°C
- Body, Lid & Locking Material: LCP
- Minimal Insertion / Withdrawal Cycles: 50
- Contact Material: Copper Alloy