The Hermaphroditic Connector has a dual wipe contact design that was developed for use in severe environments. Shallow entry angles on the contacts ensure a smooth insertion force profile, great for high-mating cycle applications.
98061A-050-2QMF
Product: 50 Pos. Hermi Connector
Plating: 30µ Au over 50µ Min Ni
Pitch: 1.27mm (.050″)
Stack Height: 9.4mm (.370”)
Mated Stack Height: 14.23mm (.560”)
Dual Row, Surface Mount (SMT)
Solder Tail Length: NA
98061B-050-2QMF
Product: 50 Pos. Hermi Connector
Plating: 30µ Au over 50µ Min Ni
Pitch: 1.27mm (.050″)
Stack Height: 9.4mm (.370”)
Mated Stack Height: 14.23mm (.560”)
Dual Row, Thru-Hole (THR)
Solder Tail Length: 2.54mm (.100″)
98061A-100-2QMF
Product: 100 Pos. Hermi Connector
Plating: 30µ Au over 50µ Min Ni
Pitch: 1.27mm (.050″)
Stack Height: 11.63mm (.458”)
Mated Stack Height: 18.69mm (.736”)
Dual Row, Surface Mount (SMT)
Solder Tail Length: NA
98061B-100-2QMF
Product: 100 Pos. Hermi Connector
Plating: 15µ Au over 50µ Min Ni
Pitch: 1.27mm (.050″)
Stack Height: 11.63mm (.458”)
Mated Stack Height: 18.69mm (.736”)
Dual Row, Thru-Hole (THR)
Solder Tail Length: 2.54mm (.100″)
Contact for P/N
Product: 480 Pos. Hermi Connector
Plating: 30µ Au over 50µ Min Ni
Pitch: 1.27mm (.050″)
Stack Height: 11.51mm (.453”)
Mated Stack Height: 23mm (.905”)
Six Row, Thru-Hole (THR)
Solder Tail Length: 2.79mm (.110″)
Features & Benefits
- Close pitch .050” centers minimize board space requirements
- 50 ohm impedance matched connector
- Hermaphroditic contacts eliminate the
need for separate male and female
connectors - Designed to meet convection, IR or
vapor phase reflow requirements
- Through-hole and SMT contact tail end
configurations are available - Precision, high strength insert molded
contacts provide reliability in critical
applications - Available with locating and mounting
features - Designed with polarization features
- RoHS Compliant (available)
Specifications
- Contact Resistance: 5 milliohm (max)
- Dielectric Withstanding Voltage: >1000 VAC (RMS) at sea level
- Current Rating: 0.75 AMP/contact (continuous)
- Insulation Resistance: >5 x 1012 ohms at 500 VDC
- Material: U.L. rated 94 V-O
- Temperature Rating: -40°C to +105°C
- Plating – Mating End: Selectively plated contact surface consisting of flash 30 micro” gold (min) over 50 micro” nickel (min)
Solder Tails: 5 micro” gold (min) over 50 micro” nickel (min) - Insertion Force: 42 grams/contact (nominal)
- Contact Material: Copper alloy
- Withdrawal Force: 22 grams/contact (nominal)
- Normal Force: 100 grams/contact (nominal)
- Shock & Vibration: MIL standard 1344
(method 2004 & 2005) - Dielectric material: Liquid crystal polymer resin