VPX3 Backplane-Cabling System

• Deployable with locking rails included with the housing kit. 
• The locking rails are over 0.5 inches lower than the current deployment rails for RTM2 which allows improved cable routing. 
• Housings are molded of dielectric material for weight savings over the previous zinc die-castings for RT2. 
• New design installs over existing guideposts. 
• Locking feature has no exposed conductive surfaces and can be installed without a tool. 
• Housing can be pre-populated with wafers and gang installed in the RTM3 modules. 
• Allows for hybrid applications along with multi-gig connectors on the same backplane. 
• RoHS Compliant products available. 

Electrical 

• 25 Gb/s Impedance: 100 ± 10 ohms 
• Insertion loss: <10 dB up to 13.5 GHz 
• Return loss: <10 dB up to 13.5 GHz 
• Crosstalk: < –30 dB up to 13.5GHz, wafer to wafer 
• Above Electrical Specifications are based on measured data for an assembly including 2 board wafers mated with RTM3 connectors and 12 inches of cable. 

Mechanical 

• Shock and vibration testing on the 3U and 6U hardware has been conducted and passed the VITA standard for the mechanical aspects. 

Environmental 

• Operating temperature: –40 °C to +105 °C